原文：http://shenzhen.chinacompositesexpo.com/en/news-detail-92-16595.htmlOn October 16th, the Low-CTE project at Guangyuan New Material's Electronic Materials Industrial Park was successfully ignited and commenced operations.


As the sixth production line in the Electronic Materials Industrial Park, the launch of this project signifies that Guangyuan New Material has achieved large-scale mass production of high-performance electronic-grade glass fiber materials, including first- and second-generation low-dielectric products, as well as high-strength, high-modulus, low-thermal-expansion materials.

With the rapid advancement of global artificial intelligence technology, the growing demand for AI servers and high-speed network systems is accelerating the adoption of high-speed multilayer PCBs and high-density interconnect (HDI) as mainstream technologies. This trend is simultaneously driving upgrades in upstream copper-clad laminates (CCL) and high-performance electronic-grade glass fiber materials. In particular, high-strength, high-modulus, low-thermal-expansion (Low-CTE) materials are now extensively used in semiconductor packaging substrates, significantly enhancing PCB performance.

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