SUZHOU, China - On May 8, Jiangsu Jujie Microfibre Group Co., Ltd. released its analysis report for a proposed placement of A-shares to specific investors.

The report states that the rapid development of AI and high-frequency communication technologies is driving continued investment in new infrastructure such as AI servers and high-speed communication networks. This has created strong demand for multi-layer PCBs, high-frequency and high-speed copper-clad laminates (CCL), and high-performance electronic fabrics, positioning high-end electronic fabric as a key growth direction for the industry.

As a leading enterprise in the field of ultra-fine composite fiber materials, Jujie Microfiber has achieved internationally-leading levels in processes such as fiber opening and precision weaving. The company’s existing business shares technological homology and operational synergies with electronic fabric production. Leveraging its technological and industrial advantages accumulated in these areas, the company will use the proceeds from this proposed offering to further expand its electronic fabric business scale, extending its business from ultra-fine composite fibers into high-end industrial composite materials.

By establishing electronic fabric production and application capabilities, Jujie Microfiber will diversify its product mix, effectively enhancing its market competitiveness while mitigating cyclical fluctuations in its traditional business. This strategic planning aligns precisely with the growth trends of emerging industries such as AI and 5G/6G, seizing a critical window for domestic substitution. The company aims to continuously improve its supply capacity for high-end products and profitability, strengthen its technological barriers and core competitiveness, and achieve a dual leap in strategic positioning and commercial value.

The total amount of funds to be raised through this proposed A-share placement is not to exceed 1.1 billion yuan (including the principal amount). The net proceeds after deducting issuance expenses will be used for the “High-End Electronic Fabric Construction Project”.